Clamp for use with electroplating apparatus and method of using the same

A method for electrolytic deposition of a coating of metal on an electroplatable substrate, the substrate having a lower edge, the method comprising the following steps:

• supporting at least one substrate in a substantially vertical plane;
• for submersion into an electrolyte bath;
• positioning the substrate over the electrolyte bath;
• submersing the substrate into the electrolyte bath;
• and
• clamping the substrate at its lower edge as the substrate enters the electrolyte bath,
• wherein the step of clamping the substrate comprises the step of moving a clamp between an open position and a closed position as the substrate is submersed into the electrolyte bath, the clamp comprising at least two levers pivotally attached to each other at a fulcrum, and at least one gripping member located on each lever for gripping the substrate, wherein the clamp, when floating on top of the electrolyte bath is in an open position, but when submersed into the electrolyte bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the open position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side on the substrate so as to grip the substrate with the gripping members.

An apparatus for electrolytic deposition of metal on a substrate, said apparatus comprising a container for containing electrolytic fluid;

• a cathode and an anode mounted in the container, and a cathode shielding device, the cathode shielding device comprising:
• an elongated trough, the trough comprising an upper edge in a plane, the trough capable of housing an electroplatable substrate in a substantially vertical plane, the substrate having a lower edge in a plane, the lower edge of the substrate located in the same plane in which lies the upper edge of the trough;
• and
• at least one clamp disposed inside in the trough for clamping the electroplatable substrate, the clamp comprising two levers at least two opposing levers, at least one lever being pivotally attached to each other at a fulcrum and movable between an open and a closed position, wherein each lever comprises a first part and a second part, the first part being integrally attached to the second part, the first part comprising a guide member for guiding an object to be clamped, each part being situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position when the clamp is submersed into a liquid.

A method for electrolytic deposition of a coating of metal on an electroplatable substrate, the substrate having lower edge, the method comprising the following steps:

• supporting at least one substrate in a substantially vertical plane over an electrolytic bath;
• submersing the substrate in the electrolytic bath;
• and
• clamping the substrate at its lower edge as the substrate enters the electrolytic bath;
• wherein the step of clamping the substrate comprises moving a clamp between an opened position and a closed position as the substrate is submersed into the electrolytic bath, the clamp comprising at least two opposing gripping members, at least one gripping member being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side on the substrate so as to grip the substrate with the gripping members.

An apparatus for electrolytic deposition of metal on a substrate, said apparatus comprising a container for containing electrolytic fluid;

• a cathode and an anode mounted in the container, and a cathode shielding device, the cathode shielding device comprising:
• an elongated trough, the trough comprising an upper edge in a plane, the trough capable of housing an electroplatable substrate in a substantially vertical plane, the substrate having a lower edge in a plane, the lower edge of the substrate located in the same plane in which lies the upper edge of the trough;
• and
• at least one clamp disposed in said trough the clamping the electroplatable substrate, the clamp comprising at least two opposing gripping members, at least one gripping member being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position the gripping members are adjacent to each other and on either side of the substrate so as to grip the substrate with the gripping members.