Flip up side stencil to be used with single site stencil printer

Abstract

Stencils to be used with a solder paste stencil printing process and apparatus in which the stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component and substrate pads. The stencil holder assembly is attached to the related solder paste stencil printer and held in place by downward force. Solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern.

Dependencies are inferred from the claim text.