System for applying fluent materials

A system for applying a fluent [thermal-cure] material to a substrate that includes means for supplying the material under pressure, means for heating the material to elevated temperature above ambient means for applying the material at said elevated temperature to a substrate, and conduit means for feeding the material from said supplying means to said heating means and thence to said applying means, characterized in that said means for heating the material comprises:

• a hollow enclosure having a substantially cylindrical internal volume, a spirally coiled tube having axially opposed first and second ends suspending said tube substantially coaxially with said volume and being coupled to said conduit means, a heater positioned within said enclosure and having means responsive to application of electrical power for heating said volume, temperature sensing means positioned within said volume for supplying electronic signals as a function of temperature thereof, said heater and said temperature sensing means being positioned within said coiled tube substantially centrally of said volume and said tube, and electronic control means including means responsive to said electronic signals for selectively applying electrical power to said heater to maintain temperature within said volume at said elevated temperature.