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AssigneeBASF SE
InventorsHelmut Tesch, Manfred Heym, Walter Doerflinger, Herbert Stutz, Peter Neumann, Dietmar Nissen, Gerhard Schaefer
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A solvent-free curable composition has a long shelf life and consists of A 100 parts by weight of an epoxy resin and B from 10 to 100 parts by weight of [,] 4,4-bis-(para-aminobenzoyl)-piperazine as a curing agent for the epoxy resin, [an aromatic diamine containing ##STR1## groups,] with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. [The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone.] The curable composition is used in particular for the preparation of fiber-reinforced materials.
An essentially solvent-free curable composition which has a long shelf life and consists of
[3. A curable composition as claimed in claim 1, wherein the epoxy resin curing agent used is a diamine of the formula ##STR7##
[4. A curable composition as claimed in claim 1, wherein the epoxy
Dependencies are inferred from the claim text.