Reinforcement laminate
AssigneeHenkel Corporation
InventorsBruce Lee Harrison, George F. Didlake
Life of this patent
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Abstract
A thermosettable adhesive is used to secure a laminate having a compliant layer (for example, a foamable composition containing a diene rubber), a layer comprised of a thermosettable resin capable of being cured to a rigid state, and an optional carrier layer (for example, a metal foil) to a substrate for the purpose of strengthening, stiffening, or otherwise reinforcing the substrate. The substrate may, for example, be a metal vehicle door. The thermosettable adhesive is comprised of at least one polyol such as a polyether polyol, at least one epoxy resin, and at least one polyisocyanate.
Claims64
A laminate comprised of
- (a) a rigid layer derived from a thermosettable resin;
- (b) a compliant layer comprised of a flexible pliable polymer;
- (c) an adhesive layer derived from a reactive thermosettable adhesive composition comprised of at least one polyol, at least one epoxy resin, and at least one polyisocyanate;
- wherein the compliant layer is located between the rigid layer and the adhesive layer.
A laminate comprised of
- (a) a carrier layer;
- (b) a rigid layer derived from a thermosettable resin comprised of an epoxy resin, said rigid layer being secured to said carrier layer;
- (c) a compliant layer comprised of at least one vulcanized diene rubber secured to said rigid layer;
- (d) an adhesive layer derived from a reactive thermosettable hotmelt adhesive composition comprised of at least one aromatic diisocyanate, at least one epoxy resin containing one or more hydroxyl groups and two or more epoxy groups per molecule and at least one latent thermally activated curative;
- and
- (e) a substrate to which the adhesive layer is secured.
The method of claim wherein at least one epoxy resin is a reaction product of epichlorohydrin and a polyhydric phenol.
A method of reinforcing a metal panel comprising
- (a) placing in contact therewith a laminate preform comprised of
- (i) a carrier layer;
- (ii) a first layer comprised of an epoxy resin secured to said carrier layer;
- (iii) a second layer comprised of a vulcanizable diene rubber secured to said first layer;
- and
- (iv) a third layer comprised of a reactive thermosettable hotmelt adhesive composition comprised of at least one aromatic diisocyanate, at least one polyether polyol, at least one epoxy resin containing one or more hydroxyl groups and two or more epoxy groups per molecule, and at least one latent thermally activated curing agent wherein the adhesive layer is on one side in contact with the compliant layer and on another side in contact with the metal panel;
- and
- (b) heating the laminate preform at a temperature effective to cure the epoxy resin in the first layer to form a rigid layer, to cure the vulcanizable diene rubber to form a compliant layer, and to cure the reactive thermosettable hotmelt adhesive composition to form an adhesive layer.
A laminate preform comprised of
- (a) a first layer comprised of a thermosettable resin;
- (b) a second layer comprised of a flexible pliable polymer or precursor thereof;
- (c) a third layer comprised of a reactive thermosettable adhesive comprised of at least one polyol, at least one epoxy resin, and at least one polyisocyanate;
- wherein the second layer is located between the first layer and the third layer.
A laminate preform comprised of:
- (a) a carrier layer;
- (b) a first layer comprised of an epoxy resin, said first layer being secured to said carrier layer;
- (c) a second layer comprised of a vulcanizable diene rubber;
- and
- (d) a third layer comprised of a reactive thermosettable hot melt adhesive composition comprised of at least one aromatic diisocyanate, at least one polyether polyol, at least one epoxy resin containing one or more hydroxyl groups and two or more epoxy groups per molecule, and at least one latent thermally activated curing agent;
- wherein the second layer is between the first layer and the third layer.
Dependencies are inferred from the claim text.