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US D807,440 S1Granted
Connector module
AssigneesMicroduino Inc., Meike Technology (Beijing) Ltd.
InventorsJian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
Life of this patent
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Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a connector module, as shown and described.