# US D574,792 S1 · Lower heat insulating cylinder for manufacturing semiconductor wafers

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- Number: US D574,792 S1
- Document ID: USD574792S1
- Status: Granted
- Kind: S1
- Application number: 29/272,820
- Filed: 2007-02-20
- Granted: 2008-08-12
- Earliest claimed: 2006-08-23
- Assignees: Tokyo Electron Limited
- Inventors: Izumi Sato
- Web page: https://patentgrep.com/patent/USD574792S1

## Abstract

Not available.

## Claims

### Claim at position 1

The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.