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US D402,638 SGranted
Temporary package for semiconductor dice
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood, David R. Hembree, Salman Akram
Life of this patent
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Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a temporary package for semiconductor dice, as shown and described.