Back to results
US D348,391 SGranted
Package for a headphone
AssigneeSony Corporation
InventorsToru Ichikawa, Yuko Wada, Yuko Suzuki, Ellen Tave, Rosalin Yin, Yoshie Nagasaka
Life of this patent
Estimating the term…
Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a package for a headphone, as shown.