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US D306,576 SGranted
Circuit module housing
AssigneesAmerican Telephone and Telegraph Company, AT&T Information Systems Inc.
InventorsJeffrey M. Hiatt, Chris G. Johnson, William H. Martin, Jr., Mark E. Millman, Timothy P. Wink
Life of this patent
Estimating the term…
Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a circuit module housing, as shown and described.