Optoelectronic arrangement

An optoelectronic arrangement comprising a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board,

• wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board,
• the first electrical contact surface and the second electrical contact surface electrically conductively connect to the optoelectronic semiconductor chip,
• a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board,
• the second circuit board comprises an electrical connector,
• an electrical connection element of the electrical connector electrically conductively connects to the first mating contact surface, and
• the first circuit board and the second circuit board connect to one another such that
• the surface of the first circuit board faces toward the surface of the second circuit board, and
• the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.