Method of manufacturing a plurality of through-holes in a layer of first material

A method of manufacturing a plurality of through-holes in a layer of first material;

• wherein an intermediate product is subjected to a plurality of method steps, the intermediate product
• defining a first side and a second side, and
• comprises a base substrate, said base substrate comprising a base material, wherein at the first side the surface of the base substrate defines a main plane;
• wherein the plurality of method steps comprises the steps of
• providing the intermediate product as a base substrate, said base substrate comprising a base material, wherein at the first side the surface of the base substrate defines a main plane;
• providing the base substrate of the intermediate product at the first side with a plurality of pits in said base material, and
• providing the base substrate with a layer of first material at the first side of the intermediate product, the first material being different from the base material so as to result in the intermediate product having pits comprising a layer of said first material,
• providing a second layer of a second material different from the first material on the layer of first material, and
• providing the second layer of the second material with a plurality of holes, the holes being provided at central locations of the pits;
• depositing a third layer of a third material different from the first material on the second layer of the second material, said depositing being performed at an angle a to the normal to the base main plane of at least 5° using said second layer of second material as a shadow mask, covering a part of the first material of the first layer with said third material at the central locations, and
• etching the exposed parts of the layer of said first material using the third layer of third material as a protective layer to provide through-holes in the layer of first material.