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US 9,972,427 B2Granted
Chip component and method of producing the same
AssigneeRohm Co., Ltd.
InventorsYasuhiro Kondo, Hiroshi Tamagawa, Hiroki Yamamoto
Life of this patent
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Abstract
A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
Claims10
A chip resistor, comprising:
- a substrate;
- a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film;
- an electrode provided on the substrate;
- and
- a plurality of fuses disconnectably connecting the plurality of resistor elements to the electrode, wherein
- the resistive film is made of at least one material selected from the group consisting of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON;
- and wherein
- the plurality of resistor elements each include a linear element, and conductive film pieces provided on the resistive film and spaced a predetermined distance from each other in a linear element extending direction, and
- a portion of the resistive film not provided with the conductive film pieces spaced the predetermined distance from each other functions as a single unit resistor body.
6 more elements
Dependencies are inferred from the claim text.