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US 9,969,078 B2Granted
Transfer head array and transferring method
AssigneeMikro Mesa Technology Co., Ltd.
InventorsLi-Yi Chen, Pei-Yu Chang, Chih-Hui Chan, Chun-Yi Chang, Shih-Chyn Lin, Hsin-Wei Lee
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Abstract
A transfer head array includes a body and a plurality of transfer heads. The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses. The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.
Claims22
A transfer head array, comprising:
- a body comprising:
- a base portion;
- and
- at least one wall portion on the base portion, wherein the wall portion defines a plurality of recesses in the body, the wall portion completely encloses a perimeter of each of the recesses in the body, the wall portion has a top surface, and the top surface of the wall portion has a plurality of grip regions;
- and
- a plurality of transfer heads respectively on the grip regions.
3 more elements
A micro device transferring method, comprising:
- gripping at least one first micro device by at least one transfer head of a transfer head array, wherein the transfer head array has at least one wall portion defining at least one recess;
- wherein an entire perimeter of the at least one recess is enclosed by said at least one wall;
- and
- putting the first micro device gripped by the transfer head of the transfer head array on a receiving substrate, wherein when putting the first micro device gripped by the transfer head of the transfer head array on the receiving substrate, at least one second micro device is located on the receiving substrate, a top surface of the second micro device is higher than a gripping surface of the transfer head in relation to the receiving substrate, the gripping surface is where the first micro device is gripped, and the second micro device is at least partially received in the recess, such that the second micro device is free from contact with the transfer head array.
1 more element
Dependencies are inferred from the claim text.