Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate

A method of bonding a polymer film, comprising the steps of:

• supplying a first polymer film in tape form from a first supply roller;
• supplying a second polymer film in tape form from a second supply roller;
• forming a first inorganic material layer on the first polymer film supplied from the first supply roller;
• forming a second inorganic material layer on the second polymer film supplied from the second supply roller;
• surface-activating a surface of the first inorganic material layer by bombardment with particles having a predetermined kinetic energy;
• surface-activating a surface of the second inorganic material layer by bombardment with particles having a predetermined kinetic energy;
• bringing the surface of the surface-activated first inorganic material layer and the surface of the surface-activated second inorganic material layer into contact to bond the first polymer film and the second polymer film;
• and
• winding a laminated polymer film formed by bonding the first polymer film and the second polymer film onto a winding roller,
• wherein the first inorganic material layer and the second inorganic material layer are formed using silicon (Si) as a main component, and comprise iron.

A method of bonding a polymer film to an inorganic material substrate, comprising the steps of:

• forming a first inorganic material layer on part or all of a polymer film;
• forming a second inorganic material layer on part or all of an inorganic material substrate;
• surface-activating a surface of the first inorganic material layer by bombardment with particles having a predetermined kinetic energy;
• surface-activating a surface of the second inorganic material layer by bombardment with particle having a predetermined kinetic energy;
• and
• bringing the surface of the surface-activated first inorganic material layer and the surface of the surface-activated second inorganic material layer into contact to bond the polymer film and the inorganic material substrate,
• wherein the first inorganic material layer and the second inorganic material layer are formed using silicon (Si) as a main component, and comprise iron.

A polymer film laminate, comprising:

• a first polymer film;
• a second polymer film;
• and
• an inorganic material layer disposed between part or all of the first polymer film and the second polymer film, and bonding the first polymer film and the second polymer film,
• wherein the inorganic material layer is formed using silicon (Si) as a main component, and comprises iron.

A laminate of a polymer film and an inorganic material substrate, comprising:

• a polymer film;
• an inorganic material substrate;
• and
• a bonding layer of inorganic material disposed between part or all of the polymer film and the inorganic material substrate, and bonding the polymer film and the inorganic material substrate,
• wherein the inorganic material layer is formed using silicon (Si) as a main component, and comprises iron.