Printed circuit boards by massive parallel assembly

A method of forming an interconnect substrate, comprising:

• providing multiple unit cells in reservoirs to a sorting unit, wherein at least two unit cells have at least one conductive line on a face of the unit cell and the at least two unit cells are of a material bondable to others of the multiple unit cells;
• sorting and orienting the multiple unit cells, using the sorting unit, according to a desired circuit pattern to produce multiple sorted and oriented unit cells;
• transferring the multiple oriented and sorted unit cells from the sorting unit to an image transfer unit;
• dispensing and arranging the multiple unit cells from the image transfer unit to form the desired circuit pattern such that a conductive line on a face of a first of the at least two unit cells contacts a conductive line on a face of a second unit cell of the at least two unit cells to form part of the desired circuit pattern;
• and
• joining the multiple unit cells to form the interconnect substrate having the desired circuit pattern.