MEMS microphone package
AssigneesAkustica, Inc., Robert Bosch GmbH
InventorJay S. Salmon
Life of this patent
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Abstract
In one embodiment a micro-electro-mechanical system (MEMS) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a MEMS die located above the ring trench, a copper pillar ring extending between the metal ring and the MEMS die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.
Claims19
A micro-electro-mechanical system (MEMS) microphone package comprising:
- a multiple layer substrate;
- an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion;
- a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion;
- a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring;
- a MEMS die located above the ring trench;
- a copper pillar ring extending between the metal ring and the MEMS die;
- and
- a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.
A method of forming a micro-electro-mechanical system (MEMS) microphone package comprising:
- forming an upper acoustic port through a plurality of upper layers of a multiple layer substrate to expose an upper surface of a membrane portion;
- forming a lower acoustic port through a plurality of lower layers of the multiple layer substrate to expose a lower surface of the membrane portion;
- forming a ring trench through at least one of the plurality of upper Pre-preg layers to expose a metal ring;
- positioning a MEMS die above the ring trench;
- and
- attaching the MEMS die to the metal ring using a copper pillar ring extending between the metal ring and the MEMS die, and using a solder pillar ring positioned on a first surface of the copper pillar ring.
Dependencies are inferred from the claim text.