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US 9,961,427 B2Granted
Display panel and preparation method therefor, and display device and health monitoring method thereof
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Optoelectronics Technology Co., Ltd.
InventorsJiuxia Yang, Yun Qiu, Zhidong Wang
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Abstract
A display panel and manufacturing method thereof, and a display device and health monitoring method thereof. The display panel includes a base substrate and a sonic sensor disposed on the base substrate. The sonic sensor is configured to monitor a sonic wave.
Claims19
A display panel, comprising:
- a base substrate;
- and
- a sonic sensor disposed on the base substrate, wherein the sonic sensor is configured to monitor a sonic wave;
- wherein the sonic sensor includes:
- a first electrode layer disposed on the base substrate;
- a silicon backboard disposed on the first electrode layer;
- a supporting layer disposed on the silicon backboard;
- a first film layer disposed on the supporting layer;
- a second electrode layer disposed on the first film layer;
- and
- a second film layer disposed on the second electrode layer,
- wherein the first film layer and the second film layer are Mylar film layers;
- and a connected sound hole is formed on the first electrode layer, the silicon backboard, the supporting layer and the first film layer.
10 more elements
A display device, comprising a display panel, wherein the display panel comprises:
- a base substrate;
- and
- a sonic sensor disposed on the base substrate, wherein the sonic sensor is configured to monitor a sonic wave;
- wherein the sonic sensor includes:
- a first electrode layer disposed on the base substrate;
- a silicon backboard disposed on the first electrode layer;
- a supporting layer disposed on the silicon backboard;
- a first film layer disposed on the supporting layer;
- a second electrode layer disposed on the first film layer;
- and
- a second film layer disposed on the second electrode layer,
- wherein the first film layer and the second film layer are Mylar film layers;
- and a connected sound hole is formed on the first electrode layer, the silicon backboard, the supporting layer and the first film layer.
10 more elements
Dependencies are inferred from the claim text.