Apparatus of fan heat dissipation
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorKuo-Chi Ting
Life of this patent
Estimating the term…
Abstract
An apparatus of fan heat dissipation comprises a fan component, a resonator and a speaker component. The fan component is located below a device in parallel and configured to dissipate heat from the device. The resonator is located below the fan component, and a working region is located between the bottom of the fan component and the top of the resonator. The speaker component is formed with the resonator, and the resonator serves as a cabinet for the speaker component. Furthermore, the resonator is the Helmholtz resonator.
Claims9
An apparatus of fan heat dissipation, the apparatus comprising:
- a fan component located below a device in parallel and configured to dissipate heat from the device;
- a resonator located below the fan component, wherein a working region is located between a bottom of the fan component and a top of the resonator;
- and
- a speaker component formed with the resonator, the resonator serving as a cabinet for the speaker component;
- wherein the resonator is a Helmholtz resonator;
- wherein the resonator comprises:
- a resonant diaphragm formed with the top of the resonator and configured to transmit energy generate from air vibration led by an operation of the fan component to an interior of the resonator.
Dependencies are inferred from the claim text.