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US 9,960,746 B2Granted
LC composite component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKuniaki Yosui, Takahiro Baba, Wataru Tamura
Life of this patent
Estimating the term…
Abstract
Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.
Claims16
An LC composite component comprising:
- a multi-layer substrate configured such that a plurality of insulating layers are stacked;
- a first pattern coil forming a coiled shape of which a first coil axis extends along a stacking direction of the multi-layer substrate, and including a coil conductor disposed between the plurality of insulating layers;
- a chip capacitive element including a body made of a material different from that of the plurality of insulating layers;
- a second pattern coil, being adjacent to the first pattern coil on a side perpendicular to the stacking direction of the multi-layer substrate, and forming a coiled shape of which a second coil axis extends along the stacking direction of the multi-layer substrate, wherein
- a direction of magnetic flux within the first pattern coil is the same as a direction of magnetic flux within the second pattern coil, and
- a center of the chip capacitive element, in a direction along which the first pattern coil and the second pattern coil are adjacent, is displaced toward a side of the second pattern coil from a center of the first pattern coil,
- all of the chip capacitive element is disposed within the coil conductor of the first pattern coil, and
- the direction of magnetic flux within the first pattern coil substantially matches the stacking direction of the multi-layer substrate.
5 more elements
An LC composite component comprising:
- a multi-layer substrate configured such that a plurality of insulating layers are stacked;
- a first pattern coil forming a coiled shape of which a first coil axis extends along a stacking direction of the multi-layer substrate, and including a coil conductor disposed between the plurality of insulating layers;
- a chip capacitive element including a body made of a material different from that of the plurality of insulating layers;
- and
- a second pattern coil being adjacent to the first pattern coil on a side perpendicular to the stacking direction of the multi-layer substrate, and forming a coiled shape of which a second coil axis extends along the stacking direction of the multi-layer substrate, wherein
- a direction of magnetic flux within the first pattern coil is opposite from a direction of magnetic flux within the second pattern coil,
- a center of the chip capacitive element, in a direction along which the first pattern coil and the second pattern coil are adjacent, is displaced toward a side opposite from the second pattern coil from a center of the first pattern coil,
- all of the chip capacitive element is disposed within the coil conductor of the first pattern coil, and
- the direction of magnetic flux within the first pattern coil substantially matches the stacking direction of the multi-layer substrate.
6 more elements
An LC composite component comprising:
- a multi-layer substrate configured such that a plurality of insulating layers are stacked;
- a first pattern coil forming a coiled shape of which a first coil axis extends along a stacking direction of the multi-layer substrate, and including a coil conductor disposed between the plurality of insulating layers;
- a chip capacitive element including a body made of a material different from that of the plurality of insulating layers;
- and
- a first inductor configured by a first conductor extending and facing the first pattern coil between the plurality of insulating layers, and connected to the first pattern coil via the chip capacitive element,
- wherein all of the chip capacitive element is disposed within the coil conductor of the first pattern coil, and
- wherein a direction of magnetic flux within the first pattern coil substantially matches the stacking direction of the multi-layer substrate.
4 more elements
Dependencies are inferred from the claim text.