Flexible circuit board and device

A flexible circuit board comprising:

• a first substrate portion;
• and
• a second substrate portion;
• wherein
• the first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;
• the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;
• the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;
• the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;
• in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space;
• and
• the second substrate portion is configured to be connected to an antenna.

A device comprising:

• a flexible circuit board including:
• a first substrate portion;
• and
• a second substrate portion;
• a first circuit board;
• and
• a second circuit board;
• wherein
• the first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;
• the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;
• the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;
• the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;
• in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space;
• both the first substrate portion and the second substrate portion include a bending portion;
• and
• the first substrate portion is connected to the first circuit board, the second substrate portion is connected to the second circuit board, and the first circuit board and the second circuit board are connected to each other through the flexible circuit board.

A device comprising:

• a flexible circuit board including:
• a first substrate portion;
• and
• a second substrate portion;
• a first circuit board;
• and
• a second circuit board;
• wherein
• the first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;
• the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;
• the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;
• the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;
• in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space;
• the second substrate portion is configured to be connected to an antenna;
• and
• the first substrate portion is connected to the first circuit board, the second substrate portion is connected to the second circuit board, the second circuit board includes the antenna, and the first circuit board and the second circuit board are connected to each other through the flexible circuit board.