Organic light emitting diode packaging method and packaging structure and device having the same

A packaging method for an organic light emitting diode, comprising:

• providing a first substrate that is made of stainless steel foil, Invar alloy or Kovar alloy;
• providing an organic light emitting diode on the first substrate;
• providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode;
• coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer;
• providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer, wherein an area of a major surface of the second transparent substrate is less than an area of a major surface of the first substrate;
• folding at least one edge of the first substrate as well as the encapsulation adhesive provided thereon so that the at least one edge of the first substrate and the encapsulation adhesive enwrap a corresponding edge of the second transparent substrate;
• filling completely a desiccant or a water absorbent at the corresponding edge enwrapped of the second transparent substrate;
• and
• curing the encapsulation adhesive, to form a package of the organic light emitting diode.