Stripping method of flexible substrate

A stripping method of a flexible substrate, comprising steps of:

• step 1, providing a porous metal substrate, and the porous metal substrate is a metal substrate comprising a plurality of holes inside, and a buffer layer is formed on the porous metal substrate;
• step 2, forming a flexible substrate on the buffer layer;
• step 3, providing an electrolytic device, and the electrolytic device comprises an electrolytic tank and an anode located in the electrolytic tank;
• step 4, loading electrolyte in the electrolytic tank of the electrolytic device;
• a multiple layer plate comprising the flexible substrate, the buffer layer and the porous metal substrate which is manufactured in the step 2 is put in the electrolytic tank in a manner that the porous metal substrate faces downward to make the porous metal substrate contact with the electrolyte, and the porous metal substrate is employed to be a cathode, and a power source is applied between the porous metal substrate and the anode to electrolyze water in the electrolyte, and the water near the porous metal substrate and in the holes inside the porous metal substrate is electrolyzed to generate hydrogen, and the hydrogen applies an acting force to the buffer layer to strip the buffer layer from the porous metal substrate to obtain the flexible substrate with the buffer layer at the bottom;
• wherein material of the porous metal substrate is iron, nickel or copper;
• wherein material of the buffer layer is a silicon oxide layer, a silicon nitride layer or a composite layer superimposed with the silicon oxide layer and the silicon nitride layer;
• wherein in the step 1, chemical vapor deposition is employed to form the buffer layer;
• wherein material of the flexible substrate is organic polymer.