Two-dimensional array of four-terminal thin film devices with surface-sensitive conductor layer and method of fabricating the same

A method of forming a semiconductor device, the method comprising:

• providing first metal contacts;
• positioning insulator pads at predefined locations on top of the first metal contacts;
• providing second metal contacts on top of the insulator pads at the predefined locations;
• and
• forming four-terminal devices defined by conductive channels contacting a pair of the first metal contacts and contacting a pair of the second metal contacts, the conductive channels of one of the four-terminal devices being physically connected, the physically connected conductive channels of the one of the four-terminal devices being physically connected to two of the first metal contacts and two of second metal contacts;
• wherein the conductive channels are surface-sensitive material defined as containing conducting states in which current moves along a surface of the surface-sensitive material, the surface-sensitive material further defined as being susceptible to having performance degradation by adsorbed impurities on the surface of the surface-sensitive material;
• wherein the surface-sensitive material is at least one of a topological insulator, a two-dimensional (2D) conductor, a 2D semiconductor, and a magnetic thin film.