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US 9,960,328 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsDavid Clark, Curtis Zwenger
Life of this patent
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Abstract
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.
Claims18
A method of manufacturing a semiconductor package, the method comprising:
- forming a first redistribution structure on an optically-transmissive carrier structure, the first redistribution structure comprising a conductive layer and a dielectric layer on the conductive layer;
- attaching a semiconductor die comprising an optical device to the first redistribution structure such that a bottom surface of the semiconductor die faces the first redistribution structure and the semiconductor die is electrically coupled through the dielectric layer to the conductive layer;
- and
- filling a region, between the bottom surface of the semiconductor die and the first redistribution structure, with an optically-transmissive underfill material.
1 more element
A semiconductor package, comprising:
- an optically-transmissive carrier structure;
- a first redistribution structure on the optically-transmissive carrier structure, the first redistribution structure comprising a plurality of conductive pads;
- and
- a semiconductor die comprising an optical device and a plurality of pillars extending from a bottom surface of the semiconductor die, the plurality of pillars attached and electrically coupled to the plurality of conductive pads such that the bottom surface of the semiconductor die faces the first redistribution structure and the optically-transmissive carrier structure wherein:
- the first redistribution structure comprises a conductive layer and a dielectric layer on the conductive layer;
- and the plurality of conductive pads are electrically coupled through the dielectric layer to the conductive layer.
3 more elements
A semiconductor package, comprising:
- an optically-transmissive carrier structure;
- a redistribution structure on the optically-transmissive carrier structure;
- a plurality of conductive pads electrically coupled to the redistribution structure, the plurality of conductive pads extending beyond an upper surface of the redistribution structure;
- and
- a semiconductor die comprising an optical device electrically coupled to the plurality of conductive pads such that the bottom surface of the semiconductor die faces the redistribution structure and the optically-transmissive carrier structure wherein:
- the redistribution structure comprises a conductive layer, a dielectric layer on the conductive layer, and a plurality of openings that pass through the dielectric layer;
- and the plurality of conductive pads are electrically coupled to the conductive layer via the plurality of openings.
4 more elements
Dependencies are inferred from the claim text.