Waveguide and semiconductor packaging

A method of fabricating sub-millimeter wavelength (SMMW) imaging system, comprising the steps of:

• batch processing a first wafer having an upper surface and a lower surface to include one or more DC through vias;
• depositing one or more solder bumps on the upper surface of the first wafer;
• batch processing a second wafer to create one or more rectangular waveguide cavities, said second wafer having a lower surface operatively connected to the upper surface of the first wafer such that the rectangular waveguide cavities are aligned with the solder bumps;
• bonding the lower surface of the second wafer to the upper surface of the first wafer;
• batch processing one or more third wafers of semiconductor material to form monolithic microwave integrated circuit (MMIC) chips;
• dicing the one or more third wafers into individual MMIC chips;
• and
• placing one or more MIMIC chips into the cavities of the second wafer so each chip is operatively coupled to one or more solder bumps.

A method of fabricating a pixel for a sub-millimeter wavelength (SMMW) imaging system, each pixel comprising:

• fabricating a chip interface layer further comprising one or more DC through vias, and depositing one or more solder balls on the upper surface of the chip interface that are coupled with the one or more DC through vias;
• fabricating a waveguide layer comprising one or more rectangular waveguide cavities said waveguide layer having a lower surface operatively connected to the upper surface of the chip interface layer such that the rectangular waveguide cavities are aligned with the solder balls;
• fabricating one or more monolithic microwave integrated circuit (MIMIC) chips;
• placing said one or more MIMIC chips into the one or more rectangular waveguide cavities so that the one or more MMIC chips are attached to the one or more solder balls on the chip interface layer and electromagnetically coupled to the one or more rectangular waveguide cavities in the waveguide layer;
• and
• fabricating an antenna layer operatively coupled to an upper surface of the waveguide layer such that an antenna is aligned with at least one of the rectangular waveguide cavities;
• wherein SMMW signals are received through the antenna, transmitted through the rectangular waveguide cavities and processed by the MIMIC chips.