Semiconductor device, display panel assembly, semiconductor structure
AssigneeNovatek Microelectronics Corp.
InventorsChieh-Hsiang Chang, Wen-Ching Huang, Kuo-Yuan Lu, Huang-Chin Tang
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Abstract
A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.
Claims16
A semiconductor device, comprising:
- a chip comprising an active surface, wherein the chip is configured to be disposed on a flexible circuit film, the flexible circuit film comprises a fan-out region, a chip region and at least one cut-out opening, and the fan-out region and the cut-out opening are located at two opposite sides of the chip region respectively;
- a plurality of first bumps disposed on the active surface along a first direction;
- and
- a plurality of second bumps, disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, and a first width of one of the first bumps is larger than a second width of one of the second bumps.
A display panel assembly, comprising:
- a display panel comprising a pixel array located in a display region of the display panel, a plurality of pads disposed on a bonding region of the display panel and a plurality of connecting lines electrically connecting the pixel array and the pads, wherein the connecting lines are divided into a plurality of groups, the display panel further comprises a plurality of multiplexers (MUX), and each of the MUXs is configured to selectively connect one of the connecting lines from one of the groups to the corresponding pad;
- and
- a flexible circuit film comprising a fan-out region connecting the bonding region, a chip region and a plurality of traces extended from the chip region to the fan-out region and electrically connected to the connecting lines;
- a chip disposed on the chip region and electrically connected to the traces, and the chip comprising an active surface;
- a plurality of first bumps disposed on the active surface along a first direction;
- and
- a plurality of second bumps, disposed on the active surface along a second direction parallel to the first direction, wherein a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, each of the traces connecting the first bumps passes through adjacent two of the second bumps to be extended to the fan-out region, and a second width of one of the second bumps is smaller than a first width of one of the first bumps.
A semiconductor structure, comprising:
- a glass substrate comprises a bonding region;
- a chip comprises an active surface and a back surface opposite to each other, wherein the chip is disposed on the bonding region with the active surface;
- and
- a carrier disposed on the back surface of the chip, wherein the carrier includes a plurality of conductive via for electrically connecting the chip and the bonding region.
Dependencies are inferred from the claim text.