Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

A device, comprising:

• a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
• a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor;
• a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end;
• and
• an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.

A device, comprising:

• a package body that includes
• a first microelectronic package that has a first sidewall, a first device-to-edge conductor with a first exposed end at a surface of the package body, and an embedded first microelectronic device that is electrically coupled with the first device-to-edge conductor, wherein the first sidewall forms a first portion of the surface of the package body, and
• a second microelectronic package stacked on the first microelectronic package, wherein the second microelectronic package has a second sidewall, a second device-to-edge conductor with a second exposed end at the surface of the package body, and an embedded second microelectronic device that is electrically coupled with the second device-to-edge conductor, wherein the second sidewall forms a second portion of the surface of the package body;
• a package surface conductor deposited on the package surface, which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor;
• and
• a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end.

A device, comprising:

• a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
• a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor;
• and
• a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end,
• wherein the package body includes a single microelectronic package, the first device-to-edge conductor is included within a first layer that is proximate a top surface of the microelectronic package, and the second device-to-edge conductor is included within a second layer that is proximate a bottom surface of the microelectronic package, the package surface extends between the top and bottom surfaces of the microelectronic package, and the package surface conductor is a top-side-to-bottom-side package surface conductor.

A device, comprising:

• a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
• a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor;
• and
• a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end,
• wherein the package body includes a single microelectronic package, the first device-to-edge conductor is included within a first layer of the microelectronic package that is proximate a bottom surface of the microelectronic package, the second device-to-edge conductor is included within a second layer that is proximate the bottom surface of the microelectronic package, the package surface is orthogonal to the bottom surface, and the package surface conductor is an inter-layer package surface conductor.