Power module
AssigneeHitachi Automotive Systems, Ltd.
InventorsShiro Yamashita, Yusuke Takagi, Takahiro Shimura
Life of this patent
Estimating the term…
Abstract
A power module includes a base plate, first, second, and third semiconductor chips. At least one of a third edge or fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate. Among a half of a distance from a first edge of the first semiconductor chip to one edge of the second semiconductor chip, a half of a distance from a second edge of the first semiconductor chip to one edge of the third semiconductor chip, and a distance from the third edge or fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.
Claims14
A power module comprising:
- a base plate;
- a first semiconductor chip having four edges;
- a second semiconductor chip having four edges, one of the four edges disposed adjacent to a first edge of the first semiconductor chip, the second semiconductor chip soldered to the base plate;
- and
- a third semiconductor chip having four edges, one of the four edges disposed adjacent to a second edge of the first semiconductor chip, the third semiconductor chip soldered to the base plate,
- wherein at least one of a third edge or a fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate, and
- among a half of a distance from the first edge of the first semiconductor chip to the one edge of the second semiconductor chip, a half of a distance from the second edge of the first semiconductor chip to the one edge of the third semiconductor chip, and a distance from the third edge or the fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.
A power module comprising:
- a first base plate;
- a second base plate disposed opposite to the first base plate, the second base plate having a projection formed on a face opposite to the first base plate;
- and
- a semiconductor chip having a first face and a second face opposite to the first face, the semiconductor chip having four edges, in which the first face is soldered to the first base plate with a first solder and the second face is soldered to the projection of the second base plate with a second solder,
- wherein in solder fillets made of the first solder formed on the four respective edges of the first face of the semiconductor chip, a length of the solder fillet formed on at least one edge of the semiconductor chip is different from lengths of the solder fillets formed on any of the other three edges, and
- lengths of solder fillets made of the second solder formed on the four respective edges of the second face of the semiconductor chip are formed shorter than the lengths of the solder fillets made of the first solder formed on the four respective edges of the first face of the semiconductor chip.
Dependencies are inferred from the claim text.