Method for manufacturing electronic component and manufacturing apparatus of electronic component

A method of electrically connecting a first substrate and a second substrate, wherein the first substrate has a first conductive pad thereon, the first conductive pad comprising a generally planar surface having a center, and the second substrate has a second conductive pad thereon, the second conductive pad comprising a generally planar surface having a center, said method comprising:

• providing a metal member having a lower melting temperature than the material of the first conductive pad and the second conductive pad on at least one of the first conductive pad or the second conductive pad;
• locating the first conductive pad on the first substrate in a facing relationship with the second conductive pad on the second substrate, wherein the center of the first conductive pad is offset from the center of the second conductive pad in a direction of the planar surface of one of the first conductive pad or the second conductive pad by a first distance;
• melting the metal member;
• moving the first and second substrates relative to each other to bring the metal member in the melted state into contact with both the first and the second conductive pads;
• and
• moving the first and second substrates relative to each other, based on detection of a relative position of the first substrate and the second substrate, in the direction of the planar surface of one of the first conductive pad or the second conductive pad and returning the metal member to a solid state, wherein
• when the metal member returns to the solid state, the distance between the center of the first conductive pad and the center of the second conductive pad is a second distance, and the second distance is less than the first distance, and the melted metal member includes a void before moving the first and second substrates relative to each other in the direction of the planar surface of one of the first conductive pad or the second conductive pad, and a volume of the void is reduced by moving the first and second substrates relative to each other in the direction of the planar surface of one of the first conductive pad or the second conductive pad.

A method of electrically connecting a first substrate and a second substrate, wherein the first substrate has a first conductive pad thereon, the first conductive pad comprising a generally planar surface having a center, and the second substrate has a second conductive pad thereon, the second conductive pad comprising a generally planar surface having a center, said method comprising:

• providing a metal member having a lower melting temperature than the material of the first and second conductive pads;
• locating the first conductive pad on the first substrate in a facing relationship with the second conductive pad on the second substrate, wherein the center of the first conductive pad is offset from the center of the second conductive pad in a direction of the planar surface of one of the first conductive pad or the second conductive pad by a first distance;
• melting the metal member;
• moving the first and second substrates relative to each other to bring the metal member in the melted state into contact with the first and second conductive pads;
• and
• moving the first and second substrates relative to each other, based on detection of a relative position of the first substrate and the second substrate, in the direction of the planar surface of one of the first conductive pad and the second conductive pad to form a single metal member in a solid state, wherein
• when the metal member returns to the solid state, the distance between the center of the first conductive pad and the center of the second conductive pad is a second distance, and the second distance is less that the first distance, and wherein the melted metal member includes a void before moving the first and second substrates relative to each other in the direction of the planar surface of one of the first conductive pad or the second conductive pad, and a volume of the void is reduced by moving the first and second substrates relative to each other in the direction of the planar surface of one of the first conductive pad or the second conductive pad.