Binding wire and semiconductor package structure using the same
AssigneeBeijing FUNATE Innovation Technology Co., Ltd.
InventorsYu-Quan Wang, Li Qian
Life of this patent
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Abstract
A semiconductor package structure includes a substrate, and a package preform. The substrate includes a plurality of conductive tracing wires. The package preform includes a semiconductor chip and a plurality of binding wires. The semiconductor chip includes a plurality of welding spots, and the welding spots are electrically connected with corresponding conductive tracing wires by the binding wires. Each binding wire comprises a carbon nanotube composite wire, the carbon nanotube composite wire includes a carbon nanotube wire and a metal layer. The carbon nanotube wire consists of a plurality of carbon nanotubes spirally arranged along an axial direction an axial direction of the carbon nanotube wire.
Claims10
A semiconductor package structure comprising:
- a substrate comprising a plurality of conductive tracing wires;
- a package preform comprising a semiconductor chip and a plurality of binding wires;
- a shielding layer covering the package preform;
- and
- a protective layer covering the shielding layer,
- wherein the semiconductor chip comprises a plurality of welding spots, and the plurality of welding spots are electrically connected with the plurality of conductive tracing wires via the plurality of binding wires;
- each of the plurality of binding wires comprises a carbon nanotube composite wire, and the carbon nanotube composite wire comprises a carbon nanotube wire and a metal layer coated on an outer surface of the carbon nanotube wire;
- the carbon nanotube wire comprises a plurality of carbon nanotubes spirally arranged along an axial direction of the carbon nanotube wire;
- a metal layer thickness ranges from about 1 micron to about 5 microns, a diameter of the carbon nanotube wire ranges from about 25 microns to about 30 microns, and a twist of the carbon nanotube wire ranges from about 100 r/cm to about 150 r/cm.
Dependencies are inferred from the claim text.