Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

A method for producing an anisotropic conductive film, comprising:

• arranging conductive particles in cavities of a mold to laminate a photo-curable adhesive layer of an adhesive film onto a surface of the mold, said surface having the conductive particles each arranged independently thereon, said adhesive layer being supported on a peeling substrate;
• compressing the adhesive layer against the mold from an upper surface of the peeling substrate to push the adhesive layer into the cavity;
• peeling the adhesive film from the mold to make a part of the conductive particle exposed at a surface of the adhesive layer and adhered thereto and form a conductive particle-containing layer having a projection-and-depression pattern molded according to the mold;
• irradiating a front surface of the conductive particle-containing layer with light, said front surface having the projection-and-depression pattern to cure the front surface;
• laminating a first insulating adhesive layer onto the front surface of the conductive particle-containing layer to make air bubbles contained between the conductive particle-containing layer and the first insulating adhesive layer,
• wherein the air bubbles are contained in accordance with the conductive particles.