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US 9,960,134 B2Granted
Semiconductor device and bump formation process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei
Life of this patent
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Abstract
A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump.
Claims20
A method of forming a semiconductor device, the method comprising:
- forming a pad region on a semiconductor substrate;
- connecting a solder bump to the pad region;
- forming a metal cap layer on a middle sidewall surface of the solder bump, wherein the metal cap layer has a first melting temperature greater than a second melting temperature of the solder bump, wherein connecting the solder bump to the pad region comprises the solder bump having a bottom portion disposed outside lateral extents of the metal cap layer;
- and
- exposing a top portion of the solder bump.
2 more elements
A method comprising:
- forming a conductive pillar over a first conductive pad of a first substrate;
- forming a metal cap layer over a top surface and over upper sidewalls of the conductive pillar, wherein the metal cap layer has a higher melting temperature than the conductive pillar;
- removing portions of the metal cap layer to expose the top surface of the conductive pillar;
- reshaping the conductive pillar after removing portions of the metal cap layer;
- and
- after reshaping the conductive pillar, attaching the top surface of the conductive pillar to a second conductive pad of a second substrate.
3 more elements
A method comprising:
- forming a solder bump over a pad region of a first substrate, wherein a lower portion of the solder bump is embedded in a mask layer and an upper portion of the solder bump is exposed by the mask layer;
- forming a metal cap layer over an upper surface of the solder bump and over sidewalls of the upper portion of the solder bump while sidewalls of the lower portion of the solder bump are covered by the mask layer;
- removing the mask layer to expose sidewalls of the lower portion of the solder bump;
- removing the metal cap layer from the upper surface of the solder bump to expose the upper surface of the solder bump;
- performing a first reflow process to reshape the solder bump;
- and
- after the first reflow process, attaching the upper surface of the solder bump to a second pad region of a second substrate.
4 more elements
Dependencies are inferred from the claim text.