Filter and capacitor using redistribution layer and micro bump layer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsiao-Tsung Yen, Jhe-Ching Lu, Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng
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Abstract
An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
Claims20
A method of forming an integrated circuit package, the method comprising:
- providing a first die having a first redistribution layer (RDL);
- forming at least one micro-bump line over the first RDL, wherein:
- the at least one micro-bump line is disposed over and on an under bump metal (UBM) pad, the UBM pad interposed between the at least one micro-bump line and the first RDL;
- and
- in a plan view, the at least one micro-bump line comprises a longitudinal axis and a transverse axis perpendicular to the longitudinal axis, wherein the longitudinal axis is longer than the transverse axis, and the at least one micro-bump line comprises a continuous distribution of material forming the at least one micro-bump line along an entirety of the longitudinal axis;
- and
- forming a filter or a capacitor comprising the first RDL, the at least one micro-bump line, or both.
A method of forming an integrated circuit package, the method comprising:
- forming a micro-bump layer extending between a first die and a second die, wherein the micro-bump layer comprises a first micro-bump line and a second micro-bump line both between a first surface of the first die and a second surface of the second die, the first micro-bump line being electrically connected to the first die and the second die through respective connectors, the first micro-bump line providing an electrical connection between the first die and the second die, the second micro-bump line being electrically isolated from one of the first die or the second die;
- and
- forming a filter comprising the second micro-bump line.
A method of forming an integrated circuit package, the method comprising:
- forming a first electrically conductive layer comprising a micro-bump layer disposed between a first die and a second die, the first die having a first plurality of active components formed therein, the second die having a second plurality of active components formed therein;
- forming a capacitor comprising a first electrode formed in the first electrically conductive layer, the first electrode comprising a first micro-bump line formed in the micro-bump layer between a first surface of the first die and a second surface of the second die parallel to the first surface, the first micro-bump line being electrically isolated from one of the first die or the second die;
- forming a second micro-bump line that is disposed between and electrically couples the first die and the second die through respective connectors;
- and
- forming a filter comprising the first micro-bump line.
Dependencies are inferred from the claim text.