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US 9,960,127 B2Granted
High-power amplifier package
AssigneeMACOM Technology Solutions Holdings, Inc.
InventorTimothy Gittemeier
Life of this patent
Estimating the term…
Abstract
Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
Claims15
A high-power microwave circuit assembled in a package comprising:
- a microwave circuit formed on a laminate;
- a case supporting conductive leads that are connected to the microwave circuit;
- a heat slug connected to the case and extending from an interior region of the case to an exterior region of the case;
- a cut-out in the laminate;
- and
- a first power transistor mounted directly on the heat slug within the cut-out of the laminate and connected to the microwave circuit.
3 more elements
Dependencies are inferred from the claim text.