Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsManabu Matsumoto, Yoshitaka Otsubo, Yasutaka Shimizu
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Abstract
According to the present invention, a semiconductor device includes a heat spreader, a semiconductor chip fixed to a mounting surface of the heat spreader via a bonding member and sealing resin that covers the heat spreader and the semiconductor chip, wherein a groove is formed on the mounting surface around the semiconductor chip, a length between the semiconductor chip and the groove is equal to or greater than a depth of the groove, and the bonding member is not provided on at least part of a region of the mounting surface between the semiconductor chip and the groove.
Claims7
A semiconductor device comprising:
- a heat spreader;
- a semiconductor chip fixed to a mounting surface of the heat spreader via a bonding member;
- and
- sealing resin that covers the heat spreader and the semiconductor chip,
- wherein a groove is formed on the mounting surface around the semiconductor chip,
- a length between the semiconductor chip and the groove is equal to or greater than a depth of the groove,
- the bonding member is not provided on at least part of a region of the mounting surface between the semiconductor chip and the groove, and
- a solder resist is provided on the mounting surface between the semiconductor chip and the groove.
Dependencies are inferred from the claim text.