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US 9,960,122 B2Granted
Composite device with substrate and mounted component
AssigneeMurata Manufacturing Co., Ltd.
InventorNoboru Kato
Life of this patent
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Abstract
A composite device includes a substrate and a mounted component mounted on a surface of, or inside, the substrate. The substrate includes a first thermoplastic resin layer. A surface of the mounted component includes a second thermoplastic resin layer that includes a same or a similar material as that of the first thermoplastic resin layer. A bonding layer that bonds the second thermoplastic resin layer and the first thermoplastic resin layer together is provided between the second thermoplastic resin layer and the first thermoplastic resin layer.
Claims20
A composite device comprising:
- a substrate;
- and
- a mounted component mounted to a surface of the substrate;
- wherein
- the substrate includes a first thermoplastic resin layer;
- at least a surface of the mounted component includes a second thermoplastic resin layer that includes a same or a similar material as that of the first thermoplastic resin layer;
- and
- a conductive bonded portion including a conductive bonding material is provided between the second thermoplastic resin layer and the first thermoplastic resin layer;
- and
- a bonding layer that bonds the second thermoplastic resin layer and the first thermoplastic resin layer together is provided between the second thermoplastic resin layer and the first thermoplastic resin layer.
7 more elements
Dependencies are inferred from the claim text.