Printed circuit board and electronic equipment

A printed circuit board comprising:

• a semiconductor package including a semiconductor element and a package substrate;
• and
• a printed wiring board on which the semiconductor package is mounted,
• wherein a plurality of first lands are formed apart from each other on a surface of the package substrate,
• wherein a plurality of second lands are formed apart from each other on a surface of the printed wiring board corresponding to the plurality of first lands,
• wherein the surface of the package substrate and the surface of the printed wiring board face each other, and each of the plurality of the first lands and a corresponding one of the plurality of the second lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at a corresponding one of the plurality of the first lands,
• wherein the package substrate includes an insulator of which a base material is ceramic,
• wherein a solder resist layer including a plurality of openings respectively corresponding to the plurality of second lands is formed on the plurality of second lands, each of the plurality of openings defining a bonded area where the solder is on the corresponding one of the plurality of second lands, and
• wherein an opening area of, at least an area where a distance between the first land and the second land corresponding to the first land is greater than an average of values of distance between the first lands and the second lands corresponding to the first lands provided over the printed wiring board, the plurality of openings is 56% or greater and 81% or less of a solder bonded area of the corresponding one of the plurality of first lands provided in the facing package substrate.