Package substrate, method for fabricating the same, and package device including the package substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsSoojae Park, Kyujin Lee
Life of this patent
Estimating the term…
Abstract
A package substrate including an insulating layer having a top surface and a bottom surface opposite to the top surface, at least one first copper pattern disposed in the insulating layer and adjacent to the top surface of the insulating layer, at least one second copper pattern disposed on the bottom surface of the insulating layer, and at least one embedded aluminum pad disposed on the at least one first copper pattern, the at least one embedded aluminum pad disposed in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer may be provided.
Claims20
A package substrate comprising:
- an insulating layer having a top surface and a bottom surface opposite to the top surface;
- at least one first copper pattern in the insulating layer, the at least one first copper pattern adjacent to the top surface of the insulating layer;
- at least one second copper pattern on the bottom surface of the insulating layer;
- and
- at least one embedded aluminum pad on the at least one first copper pattern, the at least one embedded aluminum pad in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer,
- wherein the top surface of the at least one embedded aluminum pad is at a same level as the top surface of the insulating layer, and the at least one embedded aluminum pad is on top of the at least one first copper pattern.
A package substrate comprising:
- an insulating layer including via holes;
- conductive vias filling the via holes;
- a plurality of first metal patterns in the insulating layer, the plurality of first metal pattern adjacent to a top surface of the insulating layer, the plurality of first metal pattern predominantly including copper;
- a plurality of second metal patterns in the insulating layer, the plurality of second metal patterns adjacent to a bottom surface of the insulating layer, the plurality of second metal pattern predominantly including copper;
- and
- at least one first embedded metal pad on at least one of the plurality of first metal patterns, the at least one first embedded metal pad in the insulating layer such that a top surface of the at least one first embedded metal pad is exposed by the insulating layer, the at least one first embedded metal pad predominantly including aluminum,
- wherein the top surface of the at least one first embedded metal pad is at a same level as the top surface of the insulating layer, and the at least one first embedded metal pad is on top of the at least one of the plurality of first metal patterns.
A package substrate comprising:
- an insulating layer having a top surface and a bottom surface opposite to the top surface;
- at least one first copper pattern in the insulating layer, the at least one first copper pattern being adjacent to the top surface of the insulating layer;
- at least one second copper pattern on the bottom surface of the insulating layer;
- at least one embedded aluminum pad on the at least one first copper pattern, the at least one embedded aluminum pad being in the insulating layer such that a top surface of the at least one embedded aluminum pad is exposed by the insulating layer;
- and
- a first protection layer on the top surface of the insulating layer, the first protection layer exposing the top surface of the at least one embedded aluminum pad,
- wherein a top surface of the at least one first copper pattern is positioned at a level lower than a bottom surface of the first protection layer.
Dependencies are inferred from the claim text.