Semiconductor devices and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChung-Hsi Wu, Min Lung Huang
Life of this patent
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Abstract
A semiconductor package includes a first semiconductor component, a second semiconductor component, and a connecting element. The first semiconductor component includes a first substrate, and a first bonding pad disposed adjacent to a first surface of the first substrate, and at least one conductive via structure extending from a second surface of the first substrate to the first bonding pad. The second semiconductor component includes a second substrate, a redistribution layer disposed adjacent to a first surface of the second substrate, and a second bonding pad disposed on the redistribution layer. The connecting element is disposed between the first bonding pad and the second bonding pad.
Claims20
A semiconductor package, comprising:
- a first semiconductor component comprising a first substrate having a first surface and a second surface opposite to the first surface, the first semiconductor component further comprising at least one first bonding pad disposed adjacent to the first surface of the first substrate and at least one conductive via structure extending from the second surface of the first substrate to the first bonding pad, wherein the first surface of the first substrate is an active surface of the first substrate;
- a second semiconductor component comprising a second substrate having a first surface and a second surface opposite to the first surface, the second semiconductor component further comprising a redistribution layer disposed on the first surface of the second substrate, and at least one second bonding pad disposed on the redistribution layer, wherein the first surface of the second substrate is an active surface of the second substrate, and the first surface of the first substrate faces the first surface of the second substrate;
- and
- at least one connecting element disposed between the first bonding pad and the second bonding pad.
A semiconductor package, comprising:
- a wafer having a first surface and a second surface opposite to the first surface, the first surface of the wafer is an active surface of the wafer;
- and
- a plurality of semiconductor components disposed adjacent to the first surface of the wafer, each semiconductor component comprising a substrate having a first surface and a second surface opposite to the first surface, and each semiconductor component further comprising at least one bonding pad disposed adjacent to the first surface of the substrate and at least one conductive via structure extending from the second surface of the substrate to the bonding pad, wherein each semiconductor component is electrically connected to the first surface of the wafer through the bonding pad, the first surface of the substrate is an active surface of the substrate, and the first surface of the substrate faces the first surface of the wafer.
Dependencies are inferred from the claim text.