Micro-hoses for integrated circuit and device level cooling
AssigneeRaytheon Company
InventorJason G. Milne
Life of this patent
Estimating the term…
Abstract
A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.
Claims20
A heat-dissipating device comprising:
- at least one heat-dissipating surface, and
- a cooling channel formed directly on the at least one heat-dissipating surface;
- wherein the cooling channel includes at least one fluid supply path and at least one fluid return path that extend over the at least-one heat-dissipating surface and carry a cooling medium, the at least one fluid supply path and the at least one fluid return path extending along a common plane that is adjacent and parallel to the one heat-dissipating surface, and
- wherein the cooling channel is fluidly sealed to the at least one heat-dissipating surface, the cooling medium being in thermal contact directly with the heat-dissipating surface.
A printed circuit board having at least one active or passive circuit, the printed circuit board comprising:
- a printed wire board;
- a cooling medium source;
- and
- a cooling channel printed directly to the printed wire board, the cooling channel containing a fluid supply micro-hose and a fluid return micro-hose that are in fluid communication between the cooling medium source and the printed wire board, the fluid supply micro-hose delivering a cooling medium directly to the printed wire board,
- wherein the fluid supply micro-hose and the fluid return micro-hose extend along a common plane that is adjacent and parallel to the printed wire board.
A method of forming a heat-dissipating device comprising:
- using an additive manufacturing process to form a cooling channel directly on a heat-dissipating surface of the heat-dissipating device,
- wherein the cooling channel includes at least one fluid supply path and at least one fluid return path that extend over the at least-one heat-dissipating surface and carry a cooling medium to the heat-dissipating surface, the at least one fluid supply path and the at least one fluid return path extending along a common plane that is adjacent and parallel to the one heat-dissipating surface, and
- wherein the cooling mechanism is fluidly sealed to the at least one heat-dissipating surface for direct thermal contact between the cooling medium and the at least one heat-dissipating surface.
Dependencies are inferred from the claim text.