Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
AssigneeMicron Technology, Inc.
InventorsMatt E. Schwab, J. Michael Brooks, David J. Corisis
Life of this patent
Estimating the term…
Abstract
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
Claims11
A packaged semiconductor component, comprising:
- a semiconductor die having a first composition and a first surface;
- an array of photo sensors at least partially embedded in the semiconductor die proximate to the first surface;
- a support member attached to the semiconductor die, the support member being at least substantially rigid and having a second composition different from the first composition of the semiconductor die, the support member including a plurality of heat conducting fins;
- a substrate carrying the semiconductor die and the support member attached to the semiconductor die;
- and
- an encapsulant at least partially encasing the semiconductor die, the support member, and the substrate.
A packaged semiconductor component, comprising:
- a semiconductor die having a first composition and a first surface;
- a photo sensor at least partially embedded in the semiconductor die proximate to the first surface;
- a support member attached to the semiconductor die, the support member including a plate constructed from a metal and/or a metal alloy and having a second composition different from the first composition of the semiconductor die, the support member including a plurality of heat conducting fins;
- a substrate carrying the semiconductor die and the attached support member;
- and
- an encapsulant at least partially encasing the semiconductor die, the support member, and the substrate.
Dependencies are inferred from the claim text.