Packaging structure, packaging method and template used in packaging method

A packaging method, comprising:

• providing a substrate;
• mounting a plurality of chips on the substrate;
• for each of the plurality of chips, executing steps of:
• electrically connecting the substrate with the chips via bonding wires through a wire bonding process;
• coating a surface coating material on the bottom surface of a template;
• placing the template on the substrate, the template having a cavity configured to expose entire chips, the bonding wires, and bonding pads connected with the bonding wires, the height of the template is higher than the height of the bonding wires, and a plurality of holes are formed in the template except for the cavity;
• filling into the cavity an epoxy encapsulation material through an adhesive dispensing process, and forming a protective layer by executing a curing process of the epoxy encapsulation material;
• cleaning the surface coating material with an organic solvent;
• and
• removing the template;
• wherein
• a solder ball array is formed on the bottom surface of the substrate through a ball mounting process;
• and
• cutting through the substrate by a singulation process so as to target each of the plurality of chips to form a packaging structure.