Interlayer filler composition for three-dimensional integrated circuit

An interlayer filler composition, consisting of:

• an epoxy resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s;
• a flux (B);
• a curing agent (C);
• an inorganic filler (D) having a maximum volume particle size of at most 10 μm and a volume average particle size of least 0.1 μm and at most 5 μm;
• and
• at least one additive selected from the group consisting of a coupling agent, an ultraviolet inhibitor, an antioxidant, a plasticizer, a flame retardant, a coloring agent, a dispersing agent, a fluidity-improving agent, and an adhesion-improving agent;
• wherein:
• a content of the flux (B) is at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A);
• and
• the curing agent (C) is at least one member selected from the group consisting of a phenol type curing agent, an acid anhydride type curing agent, an amide type curing agent, a tertiary amine, imidazole or a derivative thereof, an organic phosphine, a phosphonium salt, a tetraphenylborate salt, an organic acid dihydrazide, a boron halide amine complex, a polymercaptan type curing agent, an isocyanate type curing agent, and a blocked isocyanate type curing agent.

An interlayer filler composition, consisting essentially of:

• an epoxy resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s;
• a flux (B);
• a curing agent (C);
• and
• an inorganic filler (D) having a maximum volume particle size of at most 10 μm and a volume average particle size of least 0.1 μm and at most 5 μm
• wherein:
• a content of the flux (B) is at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A);
• and
• the curing agent (C) is at least one member selected from the group consisting of a phenol type curing agent, an acid anhydride type curing agent, an amide type curing agent, a tertiary amine, imidazole or a derivative thereof, an organic phosphine, a phosphonium salt, a tetraphenylborate salt, an organic acid dihydrazide, a boron halide amine complex, a polymercaptan type curing agent, an isocyanate type curing agent, and a blocked isocyanate type curing agent.

An interlayer filler composition, consisting of:

• an epoxy resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s;
• a flux (B);
• a curing agent (C);
• and
• an inorganic filler (D) having a maximum volume particle size of at most 10 μm and a volume average particle size of least 0.1 μm and at most 5 μm;
• wherein;
• a content of the flux (B) is at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A);
• and
• the curing agent (C) is at least one member selected from the group consisting of a phenol type curing agent, an acid anhydride type curing agent, an amide type curing agent, a tertiary amine, imidazole or a derivative thereof, an organic phosphine, a phosphonium salt, a tetraphenylborate salt, an organic acid dihydrazide, a boron halide amine complex, a polymercaptan type curing agent, an isocyanate type curing agent, and a blocked isocyanate type curing agent.