Joining device and joining system

A joining device for joining a first substrate and a second substrate together, comprising:

• an inverting mechanism configured to invert the first substrate such that a front surface of the first substrate is oriented downward;
• a first holding member configured to receive the inverted substrate from the inverting mechanism and including a plurality of suction ports for vacuum-sucking the first substrate to draw and hold the first substrate on a lower surface of the first holding member;
• a second holding member disposed below the first holding member and configured to vacuum-suck the second substrate to draw and hold the second substrate on an upper surface of the second holding member;
• a pressing member installed on the first holding member, including a pressing pin which moves vertically downwards pressing a center portion of the first substrate to make contact with a center portion of the second substrate while some of the plurality of suction ports of the first holding member maintain vacuum-sucking of an outer periphery portion of the first substrate;
• a plurality of vacuum pumps connected to the plurality of suction ports formed at an outer periphery portion of the first holding member, and configured to control the plurality of suction ports independently to stop vacuum-sucking sequentially from the center portion of the first substrate towards the outer periphery portion of the first substrate, thereby sequentially expanding a joining area between the first and second substrates in a circle pattern;
• and
• a guide member configured to restrain horizontal movement of the first substrate, the second substrate or a superposed substrate obtained by joining the first substrate and the second substrate together, the guide member being provided in an outer periphery portion of the second holding member,
• wherein the second holding member includes a first body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the first body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the first body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate,
• wherein the first holding member includes a second body portion formed into a size larger than the first substrate when seen in a plan view and configured to vacuum-suck the first substrate, a plurality of second pins provided on the second body portion and configured to make contact with a rear surface of the first substrate, and a second outer wall portion annularly provided on the second body portion at an outer side of the plurality of second pins and configured to support an outer periphery portion of the rear surface of the first substrate;
• and
• wherein the guide member is vertically movable from a height position where a tip end thereof protrudes upward from an upper surface of the second holding member to at least a height position where the tip end becomes flush with the upper surface of the second holding member.