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AssigneeSuss Microtec Lithography GmbH
InventorsOmar Fakhr, Dietrich Toennies
Estimating the term…
A method for curing at least in part a photoresist applied to a substrate comprises the following steps: The substrate coated with the photoresist is arranged on a support. The photoresist is subjected to a suitable temperature for curing the photoresist for a first predetermined time period. After the first predetermined time period has passed, the substrate is lifted from the support, rotated, re-placed onto the support and subjected to a suitable temperature for curing the photoresist for a second predetermined time period. This method can be performed with a device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in the chamber and on which the substrate can be arranged, and a rotating device for rotating the substrate between a first and a second phase of the curing of the photoresist.
A method for curing at least in part a photoresist applied to a substrate, wherein the following steps are carried out:
A device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in said chamber and on which said substrate can be arranged, and a rotating device for lifting and rotating said substrate relative to said support between a first and a second phase of curing of said photoresist.
Dependencies are inferred from the claim text.