Method of forming a thin film that eliminates air bubbles
AssigneeTexas Instruments Incorporated
InventorsSandra Zheng, Mark James Smiley, Douglas Jay Levack, Ronald Dean Powell
Life of this patent
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Abstract
A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.
Claims15
A method of forming a thin film in a processing station, the processing station having a wafer chuck and a supply line, the supply line having a tube dispensing opening, the method comprising:
- dispensing a fluid resin from the tube dispensing opening onto a semiconductor wafer while the semiconductor wafer is spinning, a center of the semiconductor wafer being free of the fluid resin while the semiconductor wafer is spinning and the fluid resin is dispensed;
- then placing the semiconductor wafer in a stationary state;
- and
- then dispensing the fluid resin from the tube dispensing opening onto the center of the semiconductor wafer while the semiconductor wafer is stationary to form a puddle of resin at the center of the semiconductor wafer.
A method of forming a film in a processing station, the processing station having a wafer chuck and a supply line, the supply line having a tube dispensing opening, the method comprising:
- dispensing a fluid resin from the tube dispensing opening onto a semiconductor wafer while the semiconductor wafer is spinning, a center of the semiconductor wafer being free of the fluid resin while the semiconductor wafer is spinning and the fluid resin is dispensed;
- then decelerating the semiconductor wafer to a stop;
- then dispensing the fluid resin from the tube dispensing opening onto the center of the semiconductor wafer while the semiconductor wafer is stopped to form a puddle of resin at the center of the semiconductor wafer;
- keeping the semiconductor wafer stopped until a side surface of the dispensed fluid resin changes from a bulged side surface to a tapered side surface;
- and
- then spinning the semiconductor wafer to spread the fluid resin over the semiconductor wafer.
A method of forming a film comprising:
- dispensing a fluid resin onto a semiconductor wafer while the semiconductor wafer is spinning, a center of the semiconductor wafer being free of the fluid resin while the semiconductor wafer is spinning and the fluid resin is dispensed;
- then decelerating the semiconductor wafer to a stop;
- then continuing to dispense the fluid resin from the tube dispensing opening onto the center of the semiconductor wafer while the semiconductor wafer is stopped to form a puddle of resin at the center of the semiconductor wafer;
- keeping the semiconductor wafer stopped until a side surface of the dispensed fluid resin changes from a bulged side surface to a tapered side surface;
- and
- then spinning the semiconductor wafer to spread the fluid resin over the semiconductor wafer.
Dependencies are inferred from the claim text.