Continuous writing of pattern
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorShih-Ming Chang
Life of this patent
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Abstract
The present disclosure provides one embodiment of a method that includes slicing a first sub-polygon out of the pattern layout and writing the first sub-polygon onto the substrate using a beam with a first beam setting that is associated with the first sub-polygon. The method additional includes slicing a second sub-polygon out of the remaining pattern layout that does not include the first sub-polygon. The second sub-polygon interfaces with the first sub-polygon on at least one edge. Also, the method includes, without turning off the beam after writing the first sub-polygon onto the substrate, writing the second sub-polygon onto the substrate with a second beam setting that is associated with the second sub-polygon.
Claims17
A method comprising:
- receiving a pattern layout of an integrated circuit (IC) containing a feature;
- dividing the feature into a first sub-polygon and a second sub-polygon arranged along a scanning path, wherein:
- the first sub-polygon and the second sub-polygon differ from each other in size in a first direction and in a second direction perpendicular to the first,
- the first sub-polygon interfaces with the second sub-polygon along an edge, and
- the scanning path is oblique to the edge;
- writing the first sub-polygon onto a substrate using a beam with a first beam setting that is associated with the first sub-polygon;
- and
- without interrupting the beam reaching the substrate after writing the first sub-polygon onto the substrate, writing the second sub-polygon onto the substrate by directing the beam along the scanning path, wherein the writing of the second sub-polygon is performed with a second beam setting that is associated with the second sub-polygon.
A method comprising:
- receiving a pattern layout of an integrated circuit (IC) that includes a feature;
- dividing the feature into a first shape and a second shape, wherein the first shape and the second shape differ from each other in size in a first direction and in a second direction perpendicular to the first;
- writing, by a beam with a first beam setting, the first shape onto the substrate;
- and
- without interrupting the beam reaching the substrate after writing the first shape onto the substrate, writing by the beam, the second shape onto the substrate.
A method comprising:
- receiving a pattern layout of an integrated circuit (IC) that includes a first feature and a second feature;
- determining a first shape and a second shape for the first feature according to the pattern layout, wherein the first shape and the second shape differ from each other in size in a first direction and in a second direction perpendicular to the first;
- writing, by a beam with a first beam setting, the first shape onto the substrate;
- without interrupting the beam reaching the substrate after writing the first shape onto the substrate, writing by the beam, the second shape onto the substrate;
- determining a third shape and a second scanning path for the second feature according to the pattern layout, wherein the third shape is from a group consisting of:
- a trapezoid, a triangle, a pentagon, a hexagon, a heptagon, an octagon, and a nonagon;
- writing, by the beam with a second beam setting, the second shape onto the substrate;
- and
- without turning off the beam after writing the second shape onto the substrate, writing, by the beam with the second beam setting, the second scanning path onto the substrate.
Dependencies are inferred from the claim text.