Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

A method of fabricating a thin film magnet (TFM) three-dimensional (3D) inductor structure, comprising:

• fabricating a plurality of via openings through a substrate;
• depositing a magnetic thin film layer directly on a first side and an opposing second side of the substrate, and directly lining the plurality of via openings in the substrate with the magnetic thin film layer;
• depositing a conductive material in the plurality of via openings and directly on the magnetic thin film layer lining the plurality of via openings to form a plurality of conductive vias extending through the substrate;
• fabricating a first conductive trace directly on the magnetic thin film layer on the first side of the substrate and coupling to at least one of the plurality of conductive vias;
• and
• fabricating a second conductive trace directly on the magnetic thin film layer on the second side of the substrate and coupled to at least one of the plurality of conductive vias.

A three-dimensional (3D) inductor structure, comprising:

• a substrate;
• a plurality of via openings through the substrate;
• a magnetic thin film layer directly lining the plurality of via openings and on a first side and an opposing second side of the substrate;
• a plurality of conductive vias extending through the plurality of via openings and directly on the magnetic thin film layer lining the plurality of via openings;
• a first means for conducting directly on the thin film magnetic layer on the first side of the substrate and coupling to at least one of the plurality of conductive vias;
• and
• a second means for conducting directly on the thin film magnetic layer on the second side of the substrate and coupled to at least one of the plurality of conductive vias.

A method of fabricating a three-dimensional (3D) inductor structure, comprising:

• a step for fabricating a plurality of via openings through a substrate;
• a step for depositing a magnetic thin film layer directly on a first side and an opposing second side of the substrate, and directly lining the plurality of via openings in the substrate with the magnetic thin film layer;
• a step for depositing a conductive material in the plurality of via opening and directly on the magnetic thin film layer lining the plurality of via openings to form a plurality of conductive vias extending through the substrate;
• a step for fabricating a first trace directly on the magnetic thin film layer on the first side of the substrate and coupling to at least one of the plurality of conductive vias;
• and
• a step for fabricating a second trace directly on the magnetic thin film layer on the second side of the substrate and coupled to at least one of the plurality of conductive vias.