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US 9,959,910 B2Granted
Offset-printing method for three-dimensional printed memory
AssigneesHangZhou HaiCun Information Technology Co., Ltd., Guobiao Zhang
InventorGuobiao Zhang
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Abstract
The present invention discloses an offset-printing method for a three-dimensional printed memory. The mask-patterns for different memory levels are merged onto a multi-region data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different memory levels.
Claims14
An offset-printing method for printing at least two data-coding layers in a three-dimensional printed memory with a data-mask, comprising the steps of:
- 1) forming a substrate circuit on a semiconductor wafer, wherein said wafer comprises at least two adjacent dice including first and second dice;
- 2) forming a first memory level above said substrate circuit, including a first printing step for transferring a first mask pattern to a first data-coding layer in said first memory level, wherein an origin of said data-mask is initially aligned to an origin of said first dice at said first printing step;
- 3) forming a second memory level above said first memory level, including a second printing step for transferring a second mask pattern to a second data-coding layer in said second memory level, wherein said origin of said data-mask is initially aligned to an origin of said second dice at said second printing step;
- wherein said first and second mask patterns are located on said data-mask.
1 more element
Dependencies are inferred from the claim text.